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  creat by art - glass passivated chip junction - ulterafast recovery time for high efficiency - excellent high temperature switching - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm v v rms v v dc v i f(av) a trr ns cj pf t j o c t stg o c document number: ds_d1407024 version: e14 28 97 o c/w 50 100 150 200 0.95 15 150 200 25 70 105 140 UG06A ug06b ug06c ug06d storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a note 3: measured at 1 mhz and applied reverse voltage of 4.0v d.c. - ldeally suited for use in very high frequency switching power supplies, inverters and as free wheeling diodes typical junction capacitance (note 3) operating junction temperature range - 55 to +150 9 typical thermal resistance r jl r ja maximum reverse current @ rated vr t j =25 o c t j =125 o c i r 5 a 150 maximum reverse recovery time (note 2) a maximum instantaneous forward voltage (note 1) @ 0.6 a v f v maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 0.6 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 40 50 100 unit mechanical data case: ts-1 ts-1 weight: 0.2g (approximately) maximum ratings and electrical characteristics (t a =25 o c unless otherwise noted) parameter symbol UG06A thru ug06d taiwan semiconductor glass passivated ultra fast rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec
creat by art part no. part no. ug06d ug06d (ta=25 o c unless otherwise noted) document number: ds_d1407024 version: e14 ug06d a0g a0 g green compound ratings and characteristics curves preferred p/n packing code green compound code description ug06d a0 a0 5,000 / 13" paper reel b0 ts-1 1,000 / bulk packing note 1: "x" defines voltage from 50v (UG06A) to 200v (ug06d) example ug06x (note 1) a0 suffix "g" ts-1 3,000 / ammo box (52mm taping) a1 ts-1 3,000 / ammo box (26mm taping) r0 ts-1 UG06A thru ug06d taiwan semiconductor ordering information packing code green compound code package packing 0 0.15 0.3 0.45 0.6 0.75 0 25 50 75 100 125 150 average forward rectified current (a) lead temperature ( o c) fig.1 maximum forward current derating curve resistive or inductive load 1 10 100 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum non-repetitive peak forward surge current 8.3ms single half sin wave 0.01 0.1 1 10 100 1000 0 20406080100 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics t j =50 o c t j =100 o c 0.1 1 10 0.4 0.6 0.8 1.0 1.2 1.4 1.6 instantaneous forward current (a) forward voltage (v) fig. 3 typical instantaneous forward characteristics t j =50 o c t j =100 o c pulse width=300 s 1% duty cycle
creat by art min max min max a 2.00 2.70 0.079 0.106 b 0.53 0.64 0.021 0.025 c 25.40 - 1.000 - d 3.00 3.30 0.118 0.130 e 25.40 - 1.000 - p/n = specific device code g = green compound yw = date code f = factory code document number: ds_d1407024 version: e14 marking diagram UG06A thru ug06d taiwan semiconductor package outline dimensions ts-1 dim. unit (mm) unit (inch) 1 10 100 0.1 1 10 100 junction capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1407024 version: e14 UG06A thru ug06d taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,


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